IMPACT CHEMISTRY FOR THE MICROELECTRONICS INDUSTRY
Performance meets sustainability.
intelligent fluids have proven to be an effective alternative to aggressive chemical solvents such as acetone, N-methylpyrrolidone (NMP), and dimethyl sulfoxide (DMSO/ TMAH) in microelectronic cleaning processes.
Furthermore, intelligent fluids can be customized to meet the specific requirements of production systems. Parameters like etching rates and process times can be precisely adjusted to align with individual customer needs.
Our technology offers a wide range of
applications in the microelectronics industry.
Photoresist Stripping
Photoresist stripping is an important step in semiconductor manufacturing. During lithography, a photoresist layer is used to create patterns on the wafer. After this step, the photoresist must be completely removed.
This removal process has to be very thorough. If any residue remains, it can negatively affect the next processing steps and reduce the final device performance.
intelligent fluids’ photoresist strippers remove both positive and negative photoresists in a gentle, fast, and efficient way. The solutions are suitable for LED, MEMS, and display production. They can penetrate, break down, and lift resist layers from sub-micron thickness up to more than 250 microns.
Metal Lift-Off
Metal lift-off is an important process in the fabrication of microelectronic devices such as semiconductors, LEDs, MEMS and displays. During this process, excess metal layers that were deposited on a patterned photoresist are removed.
Metal lift-off allows the formation of defined metal structures without direct metal etching. This is beneficial for metals or feature sizes where etching is technically difficult or may damage the structures.
Our fluids enable an effective lift-off process due to their specific molecular structure. They penetrate the underlying photoresist layer and break it down. The metal layer itself is not removed directly. Instead, the resist layer underneath is infiltrated and decomposed, creating an undercut. As the resist is lifted off, the metal layer on top is removed together with it.
This approach supports controlled removal and helps maintain structural integrity, even for challenging metal systems and fine geometries.
Equipment Cleaning
In semiconductor and microelectronic fabrication, cleanliness and precision are essential, as even microscopic contaminants can affect device performance. Reliable cleaning processes and short turnaround times are required to maintain process integrity and product quality.
Cleaning typically involves wet chemical methods using solvents or acids, as well as plasma cleaning to remove organic residues and particles.
intelligent fluids provides formulations for the removal of photoresists and other process chemicals. These solutions enable effective cleaning of equipment components, such as catch cups, while preserving equipment functionality and the surrounding process environment.
Your Advantages
Accelerated Cleaning Process
• Hot DI water rinse sufficient IPA rinse unnecessary
• Reduced equipment downtime & turnaround time
Lower Operating Temperature
• Application possible at 20 – 50 °C
• Lower energy costs
Environmentally Friendly
• Water-based formula
• Sustainable
• Low hazardous labelling
TCO Savings of up to 67%
Health, Safety, Security & Environment Benefits
• Improved occupational safety & better working conditions
• Replacement of aggressive solvents such as NMP, DMSO / TMAH and Acetone
• No ATEX / explosion protection required
Lower material consumption
• Longer bath lifetimes
• Low foaming formulations
• Substantial material savings
Excellent Material & Machine Compatibility
• Gentle on materials, equipment & users
• Low metal etch rates (customizable upon request)
• Longer technical-economic equipment lifespan
CO2 Reduction by up to 80%
Physical Lift-Off
Instead Of Chemical Dissolution
- Patented technology
- Effectively and gently removes contaminants
- Physical action of the fluids
- No aggressive chemical dissolution
Companies who trust us
